Package
Package
고객의 제품에 가장 적합한 다양한 Package Solution 을 제공합니다.
COB (Chip on Board)
- COB Process Consulting
- Die Attach
- Wire Bonding
- Molding
- Flip Chip Die Attach
Open Cavity PKG
- QFN 8 (3x3) ~ QFN 100 (12x12)
- LQFP 64 (10x10)
- SOIC 8, 14, 16, 20, 14, 28
- SSOP 16
SOP, SSOP, SOT
- 150mil, 208mil, 300mil
- SOP, ESOP, SSOP, ESSOP
- TSSOP, ETSSOP
- SOT23-3L, 5L, 6L
QFN, DFN
- DFN, QFN
- DFN Lead Count : 2, 6, 8, 10, 12
- QFN Lead Count : 8, 16, 20, 24, 28, 32, 40, 44, 48, 56, 64, 68, 76, 88, 100 and etc.
LQFP, TQFP
- LQFP Lead Count : 32, 48, 64, 80, 100, 128, 144, 176, 208, 256
- TQFP Lead Count : 32, 48, 64, 80, 100, 128, 144, 176
- Exposed Pad Type PKG Available
PBGA
- Plastic Ball Grid Array
- Body Size : 17mm ~ 40mm
- Ball Counts : up to 1521
CABGA, FBGA
- ChipArray Package
- LFBGA, TFBGA, VFBGA, LGA
- Body Size : 1.5mm ~ 27mm
- Ball Counts : 4 ~ 700 ball
- Stacked BGA, SiP BGA
FCBGA, FCCSP
- Flip Chip BGA Package
- FCBGA, FCCSP, FCLGA
- Solder Bump, Cu Pillar
- Ball Count : 100, 256 ~ 664, 2025 and etc.
WLCSP, Flip Chip,
Bump
- Solder Bump
- Cu Pillar
- Au Stud Bump
- 8 inch, 12 inch wafer
Wafer (Die)
Post-Processing
- Wafer Back Grinding
- Wafer Dicing (Sawing)
- MPW Wafer Dicing
- Die Back Grinding
- Sub-die Dicing
