Business
Our Business
고객의 반도체 샘플 (Prototype)과 양산 제품에 대한 최고의 PKG 솔루션을 제공합니다.
Prototype
Assembly
- 개발 제품의 Prototype Assembly Consulting
- 다양한 PKG Type Solution (WLCSP, Wafer Bump (Solder, Cu Pillar), Flip Chip BGA, FBGA, QFP, QFN & etc.)
- Own Prototype Assembly Solution (FCBGA, FBGA, QFN)
Mass
Production
- 가장 적합한 Mass Production Solution Consulting
- Quality, Price, Delivery time 등을 고려한 고객 맞춤형 solution 제공
- 경쟁력 있는 PKG Type Solution 제공 (Korean Factory, Taiwan Factory, Chinese Factory & etc.)
COB
(Chip on Board)
- COB Process Consulting
- Wire Bonding
- Flip Chip Die Attach
- High Power Microscope picture
Wafer (Die)
Post-Processing
- Wafer Back Grinding
- Wafer Dicing (Sawing)
- MPW Wafer Dicing
- Die Back Grinding
- Sub-die Dicing
