The Best Partner in Semiconductor Assembly
Mass Production
UNICHIPS is a assembly total solution company in the semiconductor field that supports the production of prototype PKG and mass production PKG for the verification of semiconductor (ASIC & SoC) products.
The Best Partner in Semiconductor Assembly
UNICHIPS is a semiconductor assembly total solution company that supports Sample (Prototype) PKG production and Mass PKG production for the verification of semiconductor (ASIC & SoC) products.
From the product development stage, we perform package production items such as package bonding review, BGA substrate design, pad open size, and pad location.
Through the above process, we prevent various problems that may occur during package production after wafer manufacturing is completed, so that the package production of the customer's product does not have any problems.
We provide the most suitable package solution for customers' various needs in terms of mass production quantity, quality requirement level, price, etc.
Our Business
We provide the best solutions in Prototype PKG and Mass Production.
Prototype
Assembly
- Prototype Assembly Consulting for Development Products
- Various PKG Type Solution (WLCSP, Wafer Bump (Solder, Cu Pillar), Flip Chip BGA, FBGA, QFP, QFN & etc.)
- Own Prototype Assembly Solution (FCBGA, FBGA, QFN)
Mass
Production
- Most Suitable Mass Production Solution Consulting
- Provide customized solutions considering Quality, Price, Delivery time, etc.
- Provide competitive PKG Type Solution (Korean Factory, Taiwan Factory, Chinese Factory & etc.)
COB
(Chip on Board)
- COB Process Consulting
- Wire Bonding
- Flip Chip Die Attach
- High Power Microscope picture
Wafer (Die)
Post-Processing
- Wafer Back Grinding
- Wafer Dicing (Sawing)
- MPW Wafer Dicing
- Die Back Grinding
- Sub-die Dicing
Package
We provide a variety of package solutions that are most suitable for our customers' products.
COB (Chip on Board)
- COB Process Consulting
- Die Attach
- Wire Bonding
- Molding
- Flip Chip Die Attach
Open Cavity PKG
- QFN 8 (3x3) ~ QFN 100 (12x12)
- LQFP 64 (10x10)
- SOIC 8, 14, 16, 20, 14, 28
- SSOP 16
SOP, SSOP, SOT
- 150mil, 208mil, 300mil
- SOP, ESOP, SSOP, ESSOP
- TSSOP, ETSSOP
- SOT23-3L, 5L, 6L
QFN, DFN
- DFN, QFN
- DFN Lead Count : 2, 6, 8, 10, 12
- QFN Lead Count : 8, 16, 20, 24, 28, 32, 40, 44, 48, 56, 64, 68, 76, 88, 100 and etc.
LQFP, TQFP
- LQFP Lead Count : 32, 48, 64, 80, 100, 128, 144, 176, 208, 256
- TQFP Lead Count : 32, 48, 64, 80, 100, 128, 144, 176
- Exposed Pad Type PKG Available
PBGA
- Plastic Ball Grid Array
- Body Size : 17mm ~ 40mm
- Ball Counts : up to 1521
CABGA, FBGA
- ChipArray Package
- LFBGA, TFBGA, VFBGA, LGA
- Body Size : 1.5mm ~ 27mm
- Ball Counts : 4 ~ 700 ball
- Stacked BGA, SiP BGA
FCBGA, FCCSP
- Flip Chip BGA Package
- FCBGA, FCCSP, FCLGA
- Solder Bump, Cu Pillar
- Ball Count : 100, 256 ~ 664, 2025 and etc.
WLCSP, Flip Chip,
Bump
- Solder Bump
- Cu Pillar
- Au Stud Bump
- 8 inch, 12 inch wafer
Wafer (Die)
Post-Processing
- Wafer Back Grinding
- Wafer Dicing (Sawing)
- MPW Wafer Dicing
- Die Back Grinding
- Sub-die Dicing
Do you have any further questions?
If you have any inquiries, feel free to contact us via email or phone. We’ll respond promptly.
Contact Us