Open Cavity Package
QFN (DFN)
Body Size(mm) Lead Count Die PAD Size (mm) Lead Pitch (mm)
3X3 (DFN) 8 1.36 X 2.20 0.65
3X3 (DFN) 10 1.36 X 2.20 0.50
3X3 12 1.36 SQ 0.65
3X3 16 1.36 SQ 0.50
4X4 12 2.30 SQ 0.80
4X4 16 2.30 SQ 0.65
4X4 20 2.30 SQ 0.50
4X4 24 2.30 SQ 0.50
5X5 16 3.30 SQ 0.80
5X5 20 3.30 SQ 0.65
5X5 24 3.10 SQ 0.65
5X5 28 3.10 SQ 0.50
5X5 32 3.30 SQ 0.50
6X6 24 4.24 SQ 0.65
6X6 28 4.24 SQ 0.65
6X6 36 4.24 SQ 0.50
6X6 40 4.24 SQ 0.50
7X7 28 5.20 SQ 0.80
7X7 32 5.20 SQ 0.65
7X7 44 5.20 SQ 0.50
7X7 48 5.20 SQ 0.50
8X8 28 6.00 SQ 0.80
8X8 32 6.00 SQ 0.80
8X8 52 6.00 SQ 0.50
8X8 56 6.00 SQ 0.50
9X9 44 6.90 SQ 0.65
9X9 64 6.90 SQ 0.50
12X12 80 9.00 SQ 0.50
12X12 100 9.00 SQ 0.40

LQFP
Body Size(mm) Lead Count Die PAD Size (mm) Lead Pitch (mm)
10X10 44 6.86 SQ 0.80
10X10 52 6.86 SQ 0.65
10X10 64 6.86 SQ 0.50

SSOP
Body Size(inch) Lead Count Die PAD Size (inch) Lead Pitch (inch)
0.150 16 0.070 X 0.100 0.025

SSOP (Heat Enhanced)
Body Size(inch) Lead Count Die PAD Size (inch) Lead Pitch (inch)
0.150 16 0.070 X 0.100 0.025

SOIC
Body Size(inch) Lead Count Die PAD Size (inch) Lead Pitch (inch)
0.150 8 0.075 X 0.100 0.50
0.150 14 0.075 X 0.100 0.50
0.150 16 0.075 X 0.120 0.50
0.300 16 0.150 X 0.220 0.50
0.300 20 0.150 X 0.220 0.50
0.300 24 0.150 X 0.220 0.50
0.300 28 0.160 X 0.230 0.50

SOIC (Heat Enhanced)
Body Size(inch) Lead Count Die PAD Size (inch) Lead Pitch (inch)
0.150 8 0.075 X 0.100 0.50
0.150 16 0.075 X 0.120 0.50
0.300 16 0.150 X 0.220 0.50
0.300 24 0.150 X 0.220 0.50
0.300 28 0.160 X 0.230 0.50

UNICHIPS Co., Ltd.
# 103-1401, 88, Sinwon-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
TEL : +82-31-256-7555    Fax : +82-31-696-5550    Email : bwchoi@unichips.co.kr
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